UMC Introduces 55nm BCD Platform to Elevate Power Efficiency for Smartphones, Consumer Electronics, and Automotive Applications

HSINCHU, Taiwan--(BUSINESS WIRE)--United Microelectronics Corporation (NYSE: UMC; TWSE: 2303)(“UMC”), a leading global semiconductor foundry, today announced the release of its 55nm Bipolar-CMOS-DMOS (BCD) platform, enabling a new level of performance and power efficiency in next-generation mobile devices, consumer electronics, automotive, and industrial applications. Designed to address the growing complexity of power management in electronic devices, the new 55nm BCD platform delivers smaller chip area, lower power consumption, and superior noise reduction, enabling greater flexibility and reliability in power circuit designs.

UMC provides brand-new comprehensive 55nm BCD solutions with competitive device performance, enabling our customers to build innovative power solutions for everything from smartphones and wearables, to automotive, smart homes and factories

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Combining analog, digital, and power functions on a single chip, BCD technology is widely used in power management and mixed-signal ICs. UMC’s new 55nm BCD platform offers comprehensive solutions to serve diversified power IC applications:

• Non-Epitaxy (Non-EPI) process: A cost-effective solution with unique device architecture, providing power efficiency and analog performance for mobile and consumer devices.
• Epitaxy (EPI) process: Compliant with the most stringent AEC-Q100 Grade 0 automotive standards, the 55nm EPI solution supports operating voltage up to 150V, enhancing automotive electronic reliability even under extreme environments.
• Silicon-on-Insulator (SOI) process: Ideal for high-grade automotive and industrial uses, this solution is AEC-Q100 Grade 1 automotive compliant, featuring superior noise reduction, high speeds, and low leakage.
• The platform also integrated ultra-thick metal (UTM), embedded flash, and resistive random-access memory (RRAM) technologies for enhanced performance and functionalities.

“The readiness of our 55nm BCD platform marks a major milestone for UMC, rounding out our specialty BCD technology portfolio and boosting our competitiveness in the power management market,” said Steven Hsu, Vice President of Technology Development at UMC. “While 55nm BCD has been in production for several years in the market, UMC provides brand-new comprehensive 55nm BCD solutions with competitive device performance, enabling our customers to build innovative power solutions for everything from smartphones and wearables, to automotive, smart homes and factories.

UMC now offers one of the industry’s most comprehensive and mature BCD portfolios, spanning process nodes from 0.35µm, 0.25µm, 0.18µm, and 0.11µm down to 55nm. Leveraging extensive voltage capabilities, broad IP resources, and robust design support, UMC delivers differentiated solutions that align with customers’ technology roadmaps and enhance their product competitiveness.

About UMC

UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry company. The company provides high-quality IC fabrication services, focusing on logic and various specialty technologies to serve all major sectors of the electronics industry. UMC’s comprehensive IC processing technologies and manufacturing solutions include Logic/Mixed-Signal, embedded High-Voltage, embedded Non-Volatile-Memory, RFSOI, BCD etc. Most of UMC's 12-in and 8-in fabs with its core R&D are located in Taiwan, with additional ones throughout Asia. UMC has a total of 12 fabs in production with combined capacity of more than 400,000 wafers per month (12-in equivalent), and all of them are certified with IATF 16949 automotive quality standard. UMC is headquartered in Hsinchu, Taiwan, plus local offices in United States, Europe, China, Japan, Korea & Singapore, with a worldwide total of 20,000 employees. For more information, please visit: http://www.umc.com.

Note from UMC Concerning Forward-Looking Statements

Some of the statements in the foregoing announcement are forward-looking within the meaning of the U.S. Federal Securities laws, including statements about introduction of new services and technologies, future outsourcing, competition, wafer capacity, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC’s filings with the U.S. Securities and Exchange Commission. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.